Signed in as:
filler@godaddy.com
HBS (Hybrid Substrate) is a multifunctional substrate that integrates thin film (TF) and packaging level processes (PLP) onto a function substrate (BT, ABF, Ceramic…). It can directly bond the top chip to HBS, simplifying the process.
Key advantages of HBS include:
•Integrated passive components for more efficient matching circuits.
•AM driver design capability within HBS.
•Direct bonding of bare chips without packaging due to fine lines/spaces.
•Flexible material and design options for functional substrates.
•High-density and large-scale integration.
HBS also offers solutions for advanced packaging.
Features
Customization and Flexibility
Customization and Flexibility
Customization and Flexibility
Tailored materials and designs cater to your unique demands, providing a platform for innovation.
Expandable Capabilities
Customization and Flexibility
Customization and Flexibility
Hybrid Substrate offers the unique advantage of expandability, allowing seamless integration and extended functionalities. It acts as a foundation for unlimited growth and enhanced capabilities, adapting to your evolving needs effortlessly.
