HBS for Advanced packaging

Performance Enhancement: Advanced packaging integrates multiple chips in one package, reducing signal delay and energy loss, improving overall performance.

Miniaturization and Integration: Advanced packaging allows more functions in a smaller space, aiding device miniaturization and portability, supporting complex systems like System-in-Package.

Design Flexibility: Advanced packaging offers greater design flexibility, allowing optimization for specific applications and different market needs, integrating chips from various processes.

Cost Efficiency: Despite high initial investment, costs are expected to decrease with technological maturity and large-scale production, enhancing competitiveness and reducing manufacturing and assembly costs.