We’re excited to announce our participation in SEMICON Japan 2024!
Hybrid Substrate (HBS)
Our Mission
At PanelSemi, our mission is to provide innovative solutions for the science and technology industry. We strive to make the world a better place through cutting-edge research and development.
HBS (Hybrid Substrate) is a multifunctional substrate that integrates thin film (TF) and packaging level processes (PLP) onto a function substrate (BT, ABF, Ceramic…). It can directly bond the top chip to HBS, simplifying the process.
Key advantages of HBS include:
•Integrated passive components for more efficient matching circuits.
•AM driver design capability within HBS.
•Direct bonding of bare chips without packaging due to fine lines/spaces.
•Flexible material and design options for functional substrates.
•High-density and large-scale integration.
HBS also offers solutions for advanced packaging.
Hybrid Substrate Application
HBS for Flexible Display
HBS for Advanced packaging
HBS for Flexible Display
PanelSemi mini-LED display serves as a communication interface between people. Using HSB technology, mini-LED displays become lightweight and flexible, allowing communication to permeate every corner of life. HBS technology also makes LED displays energy-efficient, contributing to environmental sustainability while enhancing daily life.
HBS for Antenna
HBS for Advanced packaging
HBS for Flexible Display
Low Earth orbit satellites enhance communication and life quality. PanelSemi aims to improves lives with semiconductor technology. HBS combines fine circuitry and low-loss substrates for high-frequency phased array antennas, balancing miniaturization and cost, ushering in a new era of communication.
HBS for Advanced packaging
HBS for Advanced packaging
HBS for Advanced packaging
Advanced packaging is a driving engine for technological development, especially in the AI industry. As the core technology of PanelSemi, HBS offers innovative solutions to upgrade the precision of traditional packaging substrates, helping allocate more substrate resources to the development of advanced packaging.
Collaboration Model
We welcome interested and capable partners to join us as VAR, bringing our quality products to the market.
We offer concept development services, supporting the realization of innovative ideas with the necessary resources and funding.
We look forward to collaborating on new product development, combining both expertise to create more business opportunities.
Through diverse cooperation models, we aim to inspire more innovation and business success together.
