HBS (HyBrid Substrate) is an advanced integration technology platform, characterized by ultra-fine line width and spacing (L/S) features achieved through TF (Thin Film) and PLP (Panel Level Packaging) processes.
This enables high-density interconnection, serving dual roles as an interposer and package substrate in advanced packaging. The top die is seamlessly bonded directly to the HBS.
Tailored materials and designs cater to your unique demands, providing a platform for innovation.
Hybrid Substrate offers the unique advantage of expandability, allowing seamless integration and extended functionalities. It acts as a foundation for unlimited growth and enhanced capabilities, adapting to your evolving needs effortlessly.