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Hybrid Substrate

Unlocking the Potential of High-Density Interconnection

HBS (HyBrid Substrate) is an advanced integration technology platform, characterized by ultra-fine line width and spacing (L/S) features achieved through  TF (Thin Film) and PLP (Panel Level Packaging) processes. 


This enables high-density interconnection, serving dual roles as an interposer and package substrate in advanced packaging. The top die is seamlessly bonded directly to the HBS.

Features

Customization and Flexibility

Customization and Flexibility

Customization and Flexibility

Tailored materials and designs cater to your unique demands, providing a platform for innovation.

Expandable Capabilities

Customization and Flexibility

Customization and Flexibility

Hybrid Substrate offers the unique advantage of expandability, allowing seamless integration and extended functionalities. It acts as a foundation for unlimited growth and enhanced capabilities, adapting to your evolving needs effortlessly.

Explore how our services can drive success for your business

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