方略電子 PanelSemi
方略電子 PanelSemi
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    • Home
    • Hybrid Substrate
      • Hybrid Substrate
      • HBS - Flexible Display
      • HBS - Antenna
      • HBS - Advanced packaging
      • Concept Proposal
    • LED
      • LED
      • Primary
      • Primary+
      • Rollable
      • Featured cases
      • Concept Proposal
    • Foundry
      • Foundry
      • Featured cases
      • Concept Proposal
    • Collaboration Model
    • News & Events
      • Events
      • News
      • Video
      • Awards
    • About
      • About Us
      • IP Policy
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  • Home
  • Hybrid Substrate
    • Hybrid Substrate
    • HBS - Flexible Display
    • HBS - Antenna
    • HBS - Advanced packaging
    • Concept Proposal
  • LED
    • LED
    • Primary
    • Primary+
    • Rollable
    • Featured cases
    • Concept Proposal
  • Foundry
    • Foundry
    • Featured cases
    • Concept Proposal
  • Collaboration Model
  • News & Events
    • Events
    • News
    • Video
    • Awards
  • About
    • About Us
    • IP Policy
    • Milestones
    • Contact Us
  • Careers

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Business Units

AM Mini LED Display

  • PanelSemi's Active Matrix mini/micro LED technology redefines the traditional concept of screens or displays into a FLEXIBLE, ROLL-ABLE, and MULTI-tile-ABLE solution.  
  • We call it PRIMARY, the 55-in display which can be easily transformed into different shapes, such as: Cylindrical, Concave, Convex, and S-Curve products.  Also, PRIMARY can seamless join together into various sizes.  
  • By offering new opportunities for brands and creators to engage target communities, and to deliver interactive content. PanelSemi changes the way people experience and interact with contents from display/screen, peeking their CURIOSITY and making them WONDER. 
  • We offer solutions helping Digital-Out-Of-Home more effective.

AM mini LED Backlight

  • The world's first Glass IC:  

  1. Developed using the LTPS process in the TFT industry, to drive the AM Mini LED backlight.
  2. Fully utilizes the cost advantages of the TFT industry, providing the most competitive cost.
  3. Easy to design for high local dimming zones BLU.
  4. Glass IC could be applied with a single-layer circuit board, which can significantly reduce the overall cost of the backlight module.

  • AM Mini LED backlight module:  

  1. PanelSemi solution enhances LCD with advantages such as ultra-high brightness/contrast, and  perfect gamma curve fitting.
  2. Panelsemi solution apply Pulse Amplitude Modulation (PAM) for dimming control of AM mini LED BLU, providing eye-comfort with soft light.
  3. This is also a significant mission for Panelsemi to provide a eye-comfort solution to protect consumers' eyes with PAM dimming control.

Non-display

  • Non-Display BU will focus on the AM miniLED display technology and its manufacturing processes for other industries. There are three key technologies of Panelsemi:

  1. AM(Active Matrix) substrate: fine pitch substrate with thin film transistor device.
  2. COB(Chip on broad) bonding technology for small chip.
  3. Heterogeneous integration by FR4,Ceramics and AM TFT substrate.  

  • We are collaborating with partners on developing a new architecture Panel Antenna. Additionally, the same manufacturing processes may be applied to high-power management IC and it could lead to potential applications in the electric vehicle industry. 
  • We also welcome new partners to join the Panel Semiconductor Ecosystem. Panelsemi could become a platform for technological heterogeneity integration, developing innovative products in various fields.

Panel Foundry

  • We provide the industry's first glass-based amorphous silicon/low-temperature poly-silicon TFT process foundry services, specializing in assisting customers in the development of new technologies and products for panel factories. We are responsible for providing necessary assistance in panel factory production, such as mask design, process development, experimental production, and outsourcing process services management, until the official production run.  
  • This foundry service has been tested and recognized by important semiconductor research centers in Europe and will continue to engage in strategic cooperation to develop more glass-based process technologies and components.
  •  In addition, we can also facilitate the design IP and provide possibilities for cooperation or licensing between customers. Through this service, customers can fully explore the many possibilities of glass-based processes, such as active uLED backplanes, IR sensors, X-ray sensors, microprocessors, etc.

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